太阳能硅片切割废砂浆中碳化硅陶瓷材料的回收研究  

Study on Recovery of Silicon Carbide Ceramic Materials from Solar Wafer Cutting Waste

作　　者：刘海洋[1] 吴琼[1] 蒋新宇[1] 李金元[1] 洪铎[1] 康子薇 付博[1] 李骞[1] Liu Haiyang Wu Qiong Jiang Xinyu Li Jinyuan Hong Duo Kang Ziwei Fu Bo Li Qian(School of Material Science and Engineering, Liaoning University of Technology, Liaoning, Jinzhou, 121001)

机构地区：[1]辽宁工业大学材料科学与工程学院,辽宁锦州121001

出　　处：《陶瓷》2017年第8期51-54,共4页Ceramics

摘　　要：硅片是半导体、太阳能等行业的基本材料,在硅片切割加工的废料中,含有大量的碳化硅、硅粉和铁屑。回收的碳化硅陶瓷材料,可用于硅片切割,也可用于制造半导体、功能陶瓷等。笔者以工厂提供的太阳能硅片切割废砂浆为原材料,对废砂浆进行分离提纯,对回收的碳化硅进行了X射线衍射、扫描电镜、粒度表征等分析。将酸浸除铁后的废砂在硝酸和氢氟酸作用下腐蚀硅,并检验了温度、混合酸比例、反应时间、液固比对实验的影响。通过正交实验确定最佳条件为40℃,液固比为3∶1,混合酸为硝酸:氢氟酸为5∶8,反应时间为1.5h,碳化硅的纯度为98%。Silicon wafer is the basis material of semiconductor, solar energy and other industries. The waste from cutting sil- icon wafer contains of a lot of silicon carbide particles, silicon powder and scrap iron. High economic value of silicon carbide which recycled from this waste can be used to manufacture semiconductors and functional ceramics, etc. In this paper, the solar wafer cutting waste mortar provided by the factory as raw material. Silicon carbide which was separated and purified from waste mortar was analyzed by X-- ray diffraction analysis, scanning electron microscopy analysis and particle size characterization. The iron in the waste was removed by hydrochloric acid and the silicon was corroded under the action of nitric acid and hydrofluoric acid. The effects of temperature, proportion of mixed acid, reaction time, liquid--solid ratio were examined by experiment. The best conditions can be concluded through the orthogonal experiment. The optimum con- dition were temperature 40 ℃, the liquid-- solid ratio of 3 = 1, mixed acid of nitric acid and hydrofluoric acid ratio of 5 ： 8, the reaction time was 1.5 h and the purity of silicon carbide was 98%.

关 键 词：碳化硅 陶瓷材料 切割废砂浆 回收 

分 类 号：TQ175[化学工程—硅酸盐工业]