钢铁表面HEDP镀铜与氰化镀铜工艺比较  

Process Performance Comparison between HEDP Copper Plating and Cyanide Copper Plating on Steel Substrate Surface

作　　者：邱媛[1] 彭华领 于宽深 QIU Yuan PENG Hualing YU Kuanshen(Shenyang Aircraft Corporation, Shenyang 110034, China National Defense Key Discipline Laboratory of Light Alloy Processing Science and Technology Institute, Nanchang Hang Kong University, Nan- chang 330063, China)

机构地区：[1]沈阳飞机工业(集团)有限公司工艺研究所,辽宁沈阳110034 [2]南昌航空大学轻合金加工科学与技术国防重点学科实验室,江西南昌330063

出　　处：《电镀与精饰》2017年第8期29-32,共4页Plating & Finishing

摘　　要：从镀层外观、结合力及孔隙率等镀层性能,电流密度范围、阴极电流效率、深镀能力和分散能力等镀液性能,以及氢脆性能和疲劳性能,比较了钢铁表面HEDP镀铜与氰化镀铜工艺的性能特点。结果表明:HEDP镀铜工艺的各项性能均达到或超过氰化镀铜工艺的水平。Process performances and characteristics of HEDP copper plating and cyanide copper plating on steel substrate surface were compared from the aspects of coating performance （coating appearance, adhesion and porosity, etc. ）, bath performances（ current density range, cathodic current efficiency, covering power, throwing power, etc. ）, hydrogen embrittlement performance and fatigue performance. Results showed that all the performances of HEDP copper plating process had reached or exceeded the level of cyanide copper plating process.

关 键 词：钢铁基体 镀铜 性能比较 

分 类 号：TQ153.14[化学工程—电化学工业]