LED显示器件封装现状及发展趋势  

Current Situation and Development Trend of LED Packaging for Display

作　　者：刘传标 赵强 刘晓锋 

机构地区：[1]佛山市国星光电股份有限公司,广东佛山528000

出　　处：《中国照明电器》2017年第7期31-35,共5页China Light & Lighting

摘　　要：如今,LED显示屏已在社会各个行业中广泛应用,LED显示屏器件封装经历了点阵模块、直插式、表贴三合一向COB发展,相应地LED显示屏也从单色、双色、多色到全彩的变化。LED显示屏器件朝着全彩化、小尺寸、低电流、高可靠性和低成本的不断发展,使得LED封装器件封装技术在越发重要的同时也面临着巨大的挑战。本文系统综述了LED显示屏器件封装的发展历程、目前现状以及未来的发展趋势。Nowadays, LED displays have been widely used in many kinds of occasions. LED display device packaging has experienced from the lattice modules, Lamp, Surface Mount Device to COB, and LED display also has been developed from monochrome, two-color, multicolor to full color. Meanwhile, due to the fact that development of LED device is heading to requirements of full-color, small pixel size, high reliability and low-cost, the LED packaging technology becomes more and more important as well as faces huge challenges. In this paper, the development history of the packaging of LED display device were systematically reviewed, and the current situation and future trend were also analyzed.

关 键 词：LED显示屏 封装结构 COB MICRO LED 

分 类 号：TN873[电子电信—信息与通信工程]