可延展柔性电子基底微观分析  

Micro-Analysis of the Substrate for Stretchable and Flexible Electronics

作　　者：潘开林[1] 杨帆[1] 秦晴[1] 李婷婷[1] 曹威武 Pan Kailin Yang Fan Qin Qing Li Tingting Cao Weiwu(School of Mechanical and Electronic Engineering, Guilin University of Electronic Technology, Guilin 541004, China)

机构地区：[1]桂林电子科技大学机电工程学院,广西桂林541004

出　　处：《微纳电子技术》2017年第9期591-596,638,共7页Micronanoelectronic Technology

基　　金：国家自然科学基金资助项目(61474032)

摘　　要：可延展柔性电子产品在可穿戴电子、柔性显示和医疗等领域中具有很大的应用潜力。在可延展柔性电子的应用中,可延展柔性电子基底与互连导线之间的可靠性研究受到越来越广泛的关注。以可延展柔性电子界面为研究对象,从微观机理出发讨论可延展柔性电子界面的可靠性问题,运用分子动力学(MD)的方法建立基底的微观模型。用掺杂的方式优化基底的各项性质,以提高可延展柔性电子界面的可靠性。在聚二甲基硅氧烷(PDMS)基底中掺杂SiO_2纳米粒子后的复合物,经分子动力学仿真分析得出,基底热膨胀系数随着掺杂SiO_2原子数分数的增大而减小;杨氏模量随着掺杂SiO_2原子数分数的增大而增大。这说明加入SiO_2可以很好地提高PDMS的机械特性和降低基底的热膨胀系数,使优化后的基底更加适合与互连导线结合,提高整体的可靠性。Stretchable and flexible electronic devices have great application potential in the fields of wearable electronics, flexible displays and medical treatment and so on. In practical application of the stretchable and flexible electronics, the study for the reliability between the stretchable and flexible electronic substrate and interconnect wires is concerned more and more. With the stretchable and flexible electronic interface as the research object, the reliability of the interface was discussed from the microscopic mechanism, the microscopic model of the substrate was estab- lished by using the molecular dynamics （MD） method. The properties of the substrate were opti- mized by doping to improve the reliability of the stretchable and flexible electronic interface. The MD simulation analysis of the composite after doping with SiO2 nanoparticles on PDMS substrates was carried out. The results show that with the increase of the atom fraction of the doped SiO2, the substrate thermal expansion coefficient decreases and Young＇s modulus increases, indicating that the addition of SiO2 can improve the mechanical properties expansion coefficient of the substrate, the optimized substrate with interconnect wires, and the reliability is improved. of PDMS and reduce is more suitable for the thermal combination

关 键 词：可延展电子 柔性电子 分子动力学模拟 纳米粒子 聚二甲基硅氧烷(PDMS) 

分 类 号：TB34[一般工业技术—材料科学与工程]