裸铜框架铜线键合封装技术研究  

Research of Packaging Technology for Bare-copper Leadframes with Copper Bonding

作　　者：温莉珺[1] 

机构地区：[1]天水华天科技股份有限公司,甘肃天水741000

出　　处：《电子工业专用设备》2017年第4期5-7,49,共4页Equipment for Electronic Products Manufacturing

摘　　要：对裸铜框架铜线键合封装的关键工艺进行了系统研究,通过选择合适的裸铜框架、分段烘烤方式、全密封轨道焊线机防氧化以及工序间时间间隔控制,实现铜-铜键合关键技术,这一研究结果为更多封装形式的裸铜框架实现铜线键合提供技术指导。In this paper, systematic research of critical process for bare-copper leadframes with Copper bonding, By selecting suitable bare-copper leadfxames, performing sectional baking after die bonding, antioxidanting of hermetic orbital for wire-bonding machine, and controling interval time during each process, Achieve key technology of copper-copper bonding, This result provides a guidance for more bare-copper leadframes with copper bonding.

关 键 词：裸铜框架 氧化 铜-铜键合 

分 类 号：TN405.97[电子电信—微电子学与固体电子学]