基于最小二乘法的吸咀吸取压力的研究  

Research of Suction Nozzle Pressure Based on the Least Squares

作　　者：何旭平 任保胜 祁玉斌 

机构地区：[1]山东日发纺织机械有限公司,山东聊城252000

出　　处：《电子工业专用设备》2017年第4期56-59,共4页Equipment for Electronic Products Manufacturing

摘　　要：表面贴装技术生产线中的电子元件实装机通过吸咀内的负压将电子元件吸附,从而实现对电子元器件的拾取和贴装。为便于准确掌握吸咀取料是否成功,通过将负压传感器检测到的压力变化与PMAC板卡上的A/D转换值进行对应并将其量化,对得到的数据利用最小二乘法的原理在MATLAB软件环境下进行多项式拟合,得到最优的数据曲线和数据结果。SMT production line of electronic components in the real installed by negative pressure of suction nozzle will electronic component adsorption, so as to realize pick-up and placement of electronic components. To accurately grasp the suction nozzle material success, in this paper, through the negative pressure sensors to detect changes in pressure and with PMAC board on the A/D conversion value and the quantification, the corresponding to the data by using the principle of least square method under the environment of MATLAB software, polynomial fitting, get the optimal data curves and data results.

关 键 词：表面贴装技术 吸咀 可编程多轴控制器 模/数转换 矩阵实验室 最小二乘法 

分 类 号：TN605[电子电信—电路与系统]