多结太阳电池用键合技术  

Wafer bonding applied to multi-junction solar cells

作　　者：张无迪 王赫[1] 刘丽蕊 孙强[1] 肖志斌[1] 

机构地区：[1]中国电子科技集团公司第十八研究所,天津300384

出　　处：《电源技术》2017年第9期1315-1318,共4页Chinese Journal of Power Sources

摘　　要：介绍了使用键合技术制备高效多结太阳电池的方法,即在不同材料衬底依次外延生长晶格匹配子电池,再通过键合技术将二者集成至一起。着重介绍了多种实现子电池集成的键合技术,并分析了其技术特点。Fabrication method of high-efficiency multi-junction solar cells applying wafer bonding technology wasintroduced. Lattice-matched sub-cells were grown on different material substrate by epitaxy, then the tandemsub-cells were combined through wafer bonding technology. Several different wafers bonding technology forrealization of sub-cells combination were emphatically introduced, the characteristics of these technology wasanalyzed as well.

关 键 词：键合 多结太阳电池 晶格匹配 

分 类 号：TM914[电气工程—电力电子与电力传动]