基于平板热管的大功率LED散热系统模拟及优化  

Simulation and optimization of high-power LED with flat heat pipe heat spreader

作　　者：叶祥平[1] 刘煜[1] 黄青松 YE Xiangping LIU Yu HUANG Qingsong(Guangdong Huizhou Quality ＆ Measuring Supervision Testing Institute, Huizhou 516003, Guangdong Province, China School of Aerospace Engineering, Xiamen University, Xiamen 361005, Fujian Province, China)

机构地区：[1]广东省惠州市质量计量监督检测所,广东惠州516003 [2]厦门大学航空航天学院,福建厦门361005

出　　处：《电子元件与材料》2017年第10期41-45,共5页Electronic Components And Materials

基　　金：广东省惠州市产学研结合项目(No.2014B050013002)

摘　　要：为解决大功率LED的散热问题,设计了平板热管散热器来实现LED芯片的高效散热。通过Flotherm模拟软件,对大功率LED在自然对流条件下的散热情况进行了三维数值模拟。通过平板热管与常规铜、铝散热基板对比,发现平板热管有效降低了大功率功率LED的结温和热阻,使得LED温度分布更为均匀。此外,还研究了平板热管LED散热系统在不同芯片功率下的热性能,并对四种不同排布方式的LED平板热管散热系统进行了优化,发现阵列分布其温度分布最为均匀,结温最低,是较优的排布方式。Flat heat pipe heat spreader was designed for the heat dissipation of high-power LED. The thermal performance of high-power LED in natural convection conditions was simulated by the Flotherm simulation software. It is found that the flat heat pipe reduces the junction temperature and thermal resistance compared to the conventional copper and alumina heat spreader. The thermal performance of LED with flat heat pipe heat spreader under different heat power conditions was also explored. Furthermore, four types of arrangement of the LED chips were also designed and compared for the optimization. The results indicate that the uniform array configuration induces the best uniform temperature distribution and the lowest junction temperature, and seems to be the optimum choice for high-power LED.

关 键 词：大功率LED 散热 平板热管 模拟 优化 结温 

分 类 号：TN312.8[电子电信—物理电子学]