封测代工产业面临的挑战与机会  

Challenges and Opportunities of Industry in Outsourced Semiconductor Assembly and Test

作　　者：Mark LaPedus 瞿炼均 Mark LaPedus(Taiwan Electronic Engineering album EE Times, China)

机构地区：[1]中国台湾电子工程专辑EE Times

出　　处：《集成电路应用》2017年第10期65-68,共4页Application of IC

摘　　要：在充满挑战的半导体商业环境中,封测代工(outsourced semiconductor assembly and test)工业能被预见到会有一个稳定的,在许多产品细分上强有力的增长。整个半导体行业兼并收购的活动进行得如火如荼,这对封测代工厂来说意味着越来越少的客户群。中国的封测代工生意任道而重远,扩张兼并的脚步仍在大踏步前行。Amid a challenging business environment, the outsourced semiconductor assembly and test （OSAT） industry is projected to see steady to strong growth in a number of packaging segments this year. The overall IC industry continues to witness a frenetic wave of merger and acquisition activity, which in turn translates into a dwindling customer base for OSATs. China continues to expand its efforts in the OSAT business via the acquisition route.

关 键 词：集成电路制造 封测代工产业 Fan-out晶圆级封装 

分 类 号：TN405[电子电信—微电子学与固体电子学]