CE/nano-SiO_2覆铜板的性能研究  

Study on Properties of CE/nano-SiO_2 Copper Clad Laminate

作　　者：张文根 张学英 

机构地区：[1]渭南师范学院化学与材料学院,陕西渭南714099

出　　处：《渭南师范学院学报》2017年第20期42-46,共5页Journal of Weinan Normal University

基　　金：陕西省科技计划项目:氰酸酯基高频印制电路基板的生产技术研究(2010K06-07);渭南师范学院科研计划项目:CEN-PCB基板的应用开发研究(2014YKS002);渭南师范学院特色学科建设项目:秦东化工材料资源调查(14TSXK04)

摘　　要：以热压成型法制备双酚A型氰酸酯树脂(CE)/纳米二氧化硅(nano-SiO_2)覆铜板,通过测量介电常数、介电损耗、剥离强度、热分层时间和玻璃化转变温度,探讨了nano-SiO_2含量对CE/nano-SiO_2覆铜板性能的影响。结果表明,与纯CE制成的覆铜板性能相比较,当nano-SiO_2含量为3.00%时,CE/nanoSiO_2覆铜板的介电常数和玻璃化转变温度分别提高了18.29%和0.09%,介电损耗、剥离强度和热分层时间分别下降了25.64%、18.79%和0.04%。The copper clad laminate （CCL） of CE/nano-SiO2 composites was prepared by hot pressing. The influences of nano -SiO2 content on the performances of the CCL were investigated through that dielectric constant, dielectric loss, peel strength, strat-ification time and glass transition temperature. The results show that the increase rates of dielectric constant and glass transition tem-perature of the 3.00% nan〇 -S i0 2 CCL were 18.29% and 0.09%, dielectric loss, peel strength and stratification time decreased respectively 25.64%, 18.79% and 0.04%, compared with the CCL of pure CE.

关 键 词：氰酸酯树脂 NANO-SIO2 热压 覆铜板 

分 类 号：TB332[一般工业技术—材料科学与工程]