COMSOL与Visual C++三维电阻抗有限元联合建模与仿真研究  

3D electrical impedance finite element joint modeling and simulation using COMSOL and Visual C++

作　　者：张涛[1] 章伟睿 徐灿华[2] 代萌[2] 杨滨[2] 史学涛[2] 董秀珍[2] 付峰[2] 

机构地区：[1]兰州军区联勤部药品仪器检验所,兰州730050 [2]第四军医大学生物医学工程学院,西安710032

出　　处：《医疗卫生装备》2017年第8期1-4,共4页Chinese Medical Equipment Journal

基　　金：国家自然科学基金课题(51207161);军队课题(AWS14C006);陕西省科技攻关项目(2016SF-266)

摘　　要：目的:充分利用COMSOL软件的可视化建模特点与Visual C++平台的编程特性,提出一种COMSOL与Visual C++三维电阻抗有限元联合建模与仿真方法。方法:利用COMSOL软件中的建模方法建立模型,将模型转化为.stl文件导入Visual C++仿真平台,利用Delaunay四面体网格剖分算法进行有限元剖分,完成有限元计算仿真,最终实现联合建模与仿真。结果:该方法可以对COMSOL软件中建立的模型进行导入,并可完成三维有限元仿真。结论:该方法能够适应多种建模软件建立的模型,可以方便准确地实现联合建模与仿真,具有较高的实用性。Objective To put forward a method for 3D electrical impedance finite element joint modeling and simulation using COMSOL for visual modeling and Visual C＋＋ for programming. Methods A model was established with COMSOL, and then transformed into a.stl file and introduced into Visual C ＋＋ simulation platform. Delaunay tetrahedral mesh generation algorithm was used for finite element meshing, calculation and simulation, and joint modeling and simulation were realized finally. Results Simulation result showed that the method could be used to introduce COMSOL model and complete 3D finite element simulation. Conclusion The method proves its compatibility with the models generated by multi software and practicability for joint modeling and simulation.

关 键 词：电阻抗成像 联合仿真 三维 COMSOL Visual C++ 

分 类 号：R318[医药卫生—生物医学工程] Q64[医药卫生—基础医学]