光纤布喇格光栅传感器及其封装研究进展  

Progress in fiber Bragg grating sensor and its packaging technology

作　　者：周锋 李永倩[1] 王劭龙 ZHOU Feng LI Yongqian WANG Shaolong(Department of Electronic and Communication Engineering, North China Electric Power University, Baoding Hebei 071003, China)

机构地区：[1]华北电力大学电子与通信工程系,河北保定071003

出　　处：《光通信技术》2017年第11期8-11,共4页Optical Communication Technology

基　　金：国家自然科学基金(61377088)资助;河北省自然科学基金(F2014502098)资助;中央高校基本科研业务费专项资金(2017MS191)资助

摘　　要：以光纤布喇格光栅(Fiber Bragg Grating,FBG)传感原理为基础,总结了近期国内外FBG温度、压力及应变传感器封装工艺的研究进展,从实用性角度对各种传感器的封装进行了分析。Based on the FBG sensing principle, this paper summarizes the recent research progress of FBG temperature, pressure and strain sensor packaging technology at home and abroad, and analyzes the sensor with different package from the practical point of view.

关 键 词：光纤布喇格光栅 传感器 封装工艺 

分 类 号：TN253[电子电信—物理电子学]