MEMS硅玻璃阳极键合工艺评价方法  

Evaluation method for MEMS silicon-glass anodic bonding process

作　　者：谷专元 何春华 何燕华[1] 赵前程 张大成[3] GU Zhuan-yuan HE Chun-hua HE Yan-hua ZHAO Qian-cheng ZHANG Da-cheng(School of Electronic and Information Engineering, South China University of Technology, Guangzhou 510640, China Science and Technology on Reliability Physics and Application of Electronic Component Laboratory, The Fifth Electronic Research Institute, Ministry of Industry and Information Technology, Guangzhou 510610, China National Key Laboratory of Science and Technology on Micro/Nano Fabrication,Institute of Microelectronics, Peking University,Beijing 100871, China)

机构地区：[1]华南理工大学电子与信息学院,广东广州510640 [2]工业和信息化部电子第五研究所电子元器件可靠性物理及其应用技术重点实验室,广东广州510610 [3]北京大学微电子学研究院微米/纳米加工技术国家级重点实验室,北京100871

出　　处：《传感器与微系统》2017年第10期54-56,共3页Transducer and Microsystem Technologies

摘　　要：为了得到微机电系统(MEMS)加速度计硅—玻璃阳极键合的键合强度,进行了剪切破坏测试,并结合材料力学相关理论,得到键合强度表征方法。通过对实验数据的分析,制定键合强度的失效判据,提出了一种评价硅玻璃键合工艺质量的有效方法,在工程实际中具有一定的参考价值。In order to obtain bonding strength of silicon-glass anodic bonding of micro-electro-mechanical system （MEMS ） accelerometers,shear experiments are applied. Bonding strength characterization method is set up according to related theory of mechanics of materials. Failure criterion is established based on analysis on experimental data,and an effective method is proposed to evaluate the quality of the silicon-glass bonding process, which has certain reference value in engineering application.

关 键 词：微机电系统(MEMS)加速度计 硅玻璃阳极键合 键合强度 剪切力 

分 类 号：TP212[自动化与计算机技术—检测技术与自动化装置]