Sn-Ag复合粉末低温过渡液相连接Cu/Ag异基金属  

Cu/Ag system low-temperature transient liquid phase bonding with Sn-Ag mixed powders

作　　者：邵华凯 吴爱萍[1,2,3] 包育典 

机构地区：[1]清华大学机械工程系,北京100084 [2]清华大学摩擦学国家重点实验室,北京100084 [3]先进成形制造教育部重点实验室,北京100084

出　　处：《焊接学报》2017年第10期80-84,共5页Transactions of The China Welding Institution

基　　金：国家自然科学基金资助项目(51375260)

摘　　要：基于锡-银复合粉末低温过渡液相连接,研究了银含量对接头组织及其力学性能的影响.结果表明,接头组织由界面扩散反应区和粉末原位反应区组成.随着银含量的增加,原位反应区Ag3Sn数量增多而晶粒尺寸减小,且扩散反应区IMC层厚度减小;当银含量(质量分数,下同)超过70%时,接头中残留大量银颗粒,并伴随孔洞的产生.接头力学性能随银含量变化呈先升高后降低的趋势,55%时达到最优,抗剪强度超过35 MPa,显微硬度为70HV左右.银含量较低(≤55%)时接头主要断裂在原位反应区,较高时(≥70%)则断裂在原位反应区与扩散反应区的界面处.In this study,low-temperature TLP bonding with Sn-Ag mixed powders was investigated,and the effect of Ag content on the microstructures and mechanical properties were discussed. Experimental results showed that the microstructures could be divided into three areas,interfacial diffusion reaction zone and powers' in-situ reaction zone. With the increase of the Ag content,the number of Ag_3Sn grains distributing in the in-situ reaction zone increased but their grain sizes decreased,and the thickness of the IMC layers on both the interfacial diffusion reaction zone reduced. When Ag content exceeded 70%,a great amount of Ag particles remained and a few pores formed in the bonded layer. Both shear strength and microhardness of the joints increased firstly but declined at last with the increase of the Ag content,reaching to the maximum of about 35 MPa and 70 HV,respectively. The rupture behaviors were also discussed according to the fracture surfaces.

关 键 词：Sn-Ag复合粉 TLP连接 金属间化合物 力学性能 断口分析 

分 类 号：TG407[金属学及工艺—焊接]