基于LTCC的高集成度射频前端研究  

Study on High Integration Radio Frequency Front-end Based on LTCC

作　　者：卢胜军[1] 林逸群[1] 张锦旗[1] 钱捷[1] 

机构地区：[1]中国电子科技集团公司第三十六研究所,浙江嘉兴314033

出　　处：《压电与声光》2017年第6期809-812,共4页Piezoelectrics & Acoustooptics

摘　　要：针对现代通信电子战系统对小型化射频前端的需求,该文基于低温共烧陶瓷(LTCC)技术研制出工作在30~3 000 MHz,具有高集成度的射频前端模组。该模组尺寸仅为48mm×46mm×12mm,质量仅为68.5g,在满足技术指标的同时,体积与质量均减小到原有产品的1/7。此外,该文还对三维互联和隔离度优化等高度集成关键技术进行了总结和分析。Aiming at the demand for miniaturized RF front-end for modern communications electronic warfare systems,a 30-3 000 MHz high integration radio frequency front-end module based on LTCC technology has been developed.The size of the module is 48 mm×46 mm×12 mm,and weight is only 68.5 g.Both the volume and weight are reduced to 1/7 of the original product while meeting the technical specifications.The key technologies of high integration such as 3-D interconnection and isolation optimization are also summarized and analyzed in this paper.

关 键 词：通信电子战 低温共烧陶瓷 射频前端 高集成度 

分 类 号：TN384[电子电信—物理电子学]