硅片兆声清洗技术的优化设计  

Optimization and design of wafer cleaning technology

作　　者：阎占全 YAN Zhanquan(Beijing Bluestar Cleaning Co., Ltd., Beijing 101318, China)

机构地区：[1]北京蓝星清洗有限公司,北京101318

出　　处：《清洗世界》2017年第10期31-36,共6页Cleaning World

摘　　要：介绍硅片表面兆声清洗技术的原理,研究硅片湿法清洗的原理,分析硅片兆声清洗的方法及流程图,比较了这些方法各自的特性,根据课题要求,基于兆声清洗的工艺流程,优化出适合于IC硅片的湿法清洗技术。This paper introduces the principle of sound signs in the silicon wafer surface cleaning technology, and then the principle of silicon wet cleaning is studied, and then analyzes the wafers mega sound cleaning method and flow chart, compared the characteristics of the method, which is the technical foundation for design.Then according to the topic request,based on the signs in the cleaning process, optimization of the wet method suitable for IC wafer cleaning technology

关 键 词：集成电路 IC硅片 湿法 兆声清洗 优化 

分 类 号：TN305.97[电子电信—物理电子学]