一种高频高速用覆铜板的制备及其性能研究  

Preparation and properties of Copper Clad Laminates for high frequency and high speed applications

作　　者：杨宋 顾嫒娟[1] 梁国正[1] 李兴敏[2] 陈诚[2] 肖升高 

机构地区：[1]苏州大学材料与化学化工学部,江苏苏州215123 [2]苏州生益科技有限公司,江苏苏州215024

出　　处：《印制电路信息》2017年第11期44-48,共5页Printed Circuit Information

摘　　要：高频高速是印制电路板基材发展的方向,亟需具有优异介电性能的高性能树脂。文章系统研究了聚苯醚、氰酸酯、环氧树脂三元共聚体系的性能,研制了一种综合性能优异的无卤阻燃覆铜板,可应用于高频和高速领域。High frequency and high speed are the development directions of printed circuit board substrates,so high performance resins with excellent dielectric properties are urgently needed.A new three component copolymerization system consisting of polyphenylene oxide,cyanate ester and epoxy resin was developed,and a halogen free flame retardant copper clad laminate（CCL） with excellent comprehensive properties was developed and has a broad application prospects in the field of high frequency and high speed.

关 键 词：聚苯醚 氰酸酯 环氧树脂 覆铜板 

分 类 号：TN41[电子电信—微电子学与固体电子学]