系统级集成射频垂直互连技术  

RF Vertical Interconnection for System-Scale Integrated

作　　者：廖承举 王辉[1] 向伟玮[1] 赵鸣霄 

机构地区：[1]中国电子科技集团公司第二十九研究所,四川成都610036

出　　处：《电子工艺技术》2017年第6期319-322,共4页Electronics Process Technology

摘　　要：随着电子装备朝着多功能、高性能方向发展的同时,硬件还要变轻、变小,成本还要更低,其内部模块/组件集成密度要求不断提升,传统的平面混合集成密度已接近极限,三维异质异构集成必将成为新一代电子功能单元的主流形态。系统级集成射频垂直互连技术是三维异质异构集成系统的关键技术之一,对系统级集成射频垂直互连技术的发展动态及应用前景进行了综述。With the development of electronic equipment in a multi-functional and high-performance direction,the hardware will be lighter,smaller and less cost,3D Heterogeneous integrated becomes a trend and necessity. System-scale integrated RF vertical interconnection is one of key techniques for 3D heterogeneous integrated system. The development of System-scale RF vertical interconnection for systemscale integrated was summarized.

关 键 词：三维异质异构集成 系统级集成 射频互连 垂直互连 

分 类 号：TN605[电子电信—电路与系统]