引线键合的失效机理及分析  

Failure Mechanism and Analysis of Wire Bonding

作　　者：贺玲[1] 刘洪涛[1] 

机构地区：[1]中国电子科技集团公司第47研究所,沈阳110032

出　　处：《微处理机》2017年第6期17-20,共4页Microprocessors

摘　　要：随着电子封装系统的发展,封装系统对可靠性及使用寿命的要求不断提高。引线键合作为半导体后道工序中的关键工序,在未来相当长一段时间内仍将是封装内部链接的主流方式。引线键合工艺的可靠性是半导体器件可靠性的一个重要组成部分,尤其对电路的长期可靠性影响很大,据国外的统计数据显示键合系统的失效占整个半导体器件失效模式比例的25%~30%。严格控制器件的生产工艺环境以及引线的键合工艺质量尤为重要。针对单芯片集成电路加工过程中遇到的键合失效模式,对过程进行分析,找出引线键合失效的原因,提出了改善方法。With the development of electronic packaging system,the requirements for reliability and service life are continuously increased.As the key process of semiconductor post process, wire bonding will still be the mainstream way of packaging internallinks for a long time to come.The reliability of wire bond-ing process is an important part of the reliability of semiconductor devices,especially influencing the long term reliability of circuit heavily,and according to the foreign statistical data, it shows that the failure rate of the bonding system accounts for 2 5 %耀30 % of the failure mode of the whole semiconductor device.It is very important to control the manufacturing process and the wire bonding process quality.According to the bonding failure modes encountered in the process of single chip integrated circuits processing,the process is analyzed,so as to find out the reason of wire bonding failure,and to propose improvement methods.

关 键 词：引线键合 失效机理 稳定性 可靠性 失效模式 断裂 

分 类 号：TN43[电子电信—微电子学与固体电子学]