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作 者:陈昀 任重 梁田 CHENYun;RENZhong;LIANG Tian(Nanjing Sanle Group Co.,Ltd ,Nanjing 211800 ,China)
出 处:《真空电子技术》2017年第6期62-64,77,共4页Vacuum Electronics
摘 要:微波真空电子器件广泛应用于雷达、卫星导航以及医疗等方面。复合腔片作为耦合腔行波管中的重要件,其制备工艺质量决定了整管能否稳定可靠工作。本文研究了耦合腔行波管复合腔片真空扩散焊制备工艺,采用该工艺,复合腔片无明显变形,满足二次精加工尺寸精度;并采用扫描电镜结合能量色散谱分析发现,扩散界面平直、没有"死空间"等缺陷;抗拉强度达到210 MPa以上;漏气率小于10-11 Pa·m3/s;解决了焊料蒸发以及零件内壁和内壁气体迁移到管内,而降低管内真空度问题,提升了器件寿命。Microware vacuum electron devices are widely used in radar,satellite communication,medical treatment,etc.Composite chamber piecesare very important parts of CCTWTs,and their qualities determine whether the TWTs can work effectively.This paper presents a diffusion welding preparation process of the composite chamber piecesfor CCTWTs.With this process,the composite chamber pieces haveno obvious deformation,and can meet thedimensional precisionrequirements of 2 ndfinish machining.The SEM and EDS analysis all showed that the diffusion interface was straight,and there was no " dead space".The tensile strength of the composite chamber piecescan reach 210 MPa,and the leak rate is less than 10-11 Pa·m^3/s.Vacuum deterioration in the tube resulted from solderevaporation and gas release from the inner wall was solved and therefore the service life of the device was improved.
关 键 词:耦合腔行波管 复合腔片 扩散焊 扫描电镜 能量色散谱 抗拉强度 漏气率
分 类 号:TN105[电子电信—物理电子学]
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