面向SIP互连分析的电磁仿真求解器实现  

Implementation of an electromagnetic simulation solver for SIP( system in package) interconnect analysis

作　　者：高军 缪旻[1] 胡变香 赵凯[1] 李振松[1] GAO Jun;MIAO Min;HU Bianxiang;ZHAO Kai;LI Zhensong(Information Microsystem Institute, Beijing Information Science ＆ Technology University, Beijing 100101, China)

机构地区：[1]北京信息科技大学信息微系统研究所,北京100101

出　　处：《北京信息科技大学学报（自然科学版）》2017年第6期39-43,共5页Journal of Beijing Information Science and Technology University

基　　金：国家自然科学基金项目(61674016);国家重点基础研究发展计划(973计划)资助项目(2015CB057201);北京市属高等学校高层次人才引进与培养计划资助项目(长城学者培养计划)(CIT&TCD20150320)

摘　　要：为了实现系统级封装互连中电磁场分布的快速建模及简单高效的计算,从其分布特点出发,提出了基于时域有限差分法(Finite Difference Time Domain,FDTD)的仿真算法,相应编制了一款电磁场仿真求解器软件的原型程序。最后以TSV(Through Silicon Vias)转接板中均匀平行板传输线上TEM(Transverse Electromagnetic)波一维传播的全波仿真为例,将该求解器的求解结果与理论分析结果进行对比,对其有效性进行了验证。In order to realize the fast modeling and simple, efficient calculation of electromagnetic field distribution in system in package interconnection, a simulation algorithm based on finite difference time domain （FDTD） is established, regarding the characteristics of the corresponding field distribution. A prototype program of electromagnetic field simulation solver software is then developed. Finally, the full wave simulation of TEM （Transverse electromagnetic ） wave in uniform parallel plate transmission lines of TSV （Through Silicon Vias ） interposer is taken as an example. The solution of the electromagnetic field simulator is compared with the theoretical analysis result, and its validity is thus verified.

关 键 词：系统级封装 时域有限差分法 电磁场求解器 

分 类 号：TP391[自动化与计算机技术—计算机应用技术]