工艺参数对一种镍基单晶高温合金TLP接头组织的影响  

Effect of Process Parameters on the Microstructure of TLP Joints for a Ni-base Single Crystal Superalloy

作　　者：关洪魏 李文[1] 刘纪德[2] 

机构地区：[1]沈阳理工大学材料科学与工程学院,沈阳110159 [2]中国科学院金属研究所,沈阳110016

出　　处：《沈阳理工大学学报》2017年第5期84-89,共6页Journal of Shenyang Ligong University

摘　　要：研究了用Ni-Cr-B中间层合金在不同连接温度和连接时间条件下TLP连接一种镍基单晶高温合金,观察其接头组织变化。TLP接头分为三个典型的区域:接头中心的共晶区、位于共晶区两侧的等温凝固区和位于基体中的扩散影响区。接头中心形成Cr2B+γ和Ni3B+γ两种共晶;等温凝固区为γ镍基固溶体;在扩散区上形成M3B2析出相。随连接温度的升高或连接时间的延长均有助于共晶区硼化物析出相的分解和扩散,促进等温凝固界面由接头两侧向接头中心生长,促使扩散影响区的析出相继续长大并向基体内扩散。A Ni-based single crystal superalloy connected with Ni-Cr-B interlayer at differ-ent temperatures and times is studied to observe the changes of the microstructure. The re-sults showed that the TLP joint region consisted of eutectic zone（EZ）,isothermal solidifica-tion zone（ISZ）and Diffusion affected zone（DAZ）. Cr2 B＋γ and Ni3 B＋γ eutectic occur in the eutectic zone of the joint center. The isothermal solidification zone is the solid solution of γ Ni- based solid solution. M3 B2 precipitates are formed in the diffusion zone. The in-creasing of the bonding temperature or the holding time contributes to the decomposition and diffusion of the boride precipitation,forwards the interface of the isothermal solidification stretching from two sides to the center of the joint,and the precipitation phases in the diffu-sion-affected zone continue to grow and spread to the matrix.

关 键 词：TLP连接 Ni-Cr-B中间层合金 镍基单晶高温合金 微观组织 

分 类 号：TG146[一般工业技术—材料科学与工程]