固结金刚石聚集体磨料垫高效研磨氧化锆陶瓷背板  

Efficient lapping zirconia ceramic back with fixed diamond aggregation pad

作　　者：王子琨 凌顺志 黄道万 陈佳鹏[1] 李军[1] 朱永伟[1] 

机构地区：[1]南京航空航天大学江苏省精密与微细制造技术重点实验室,南京210016

出　　处：《金刚石与磨料磨具工程》2017年第6期12-18,共7页Diamond & Abrasives Engineering

基　　金：国家自然科学基金(51675276);南京航空航天大学研究生创新基地开放基金(kfjj20160502)

摘　　要：氧化锆陶瓷背板的高效低损伤研磨加工是其在5G通讯应用中的前提。针对氧化锆材料的硬脆特性造成磨粒磨损严重的特点,以金刚石单晶和聚集体为磨料,制备固结磨料垫(FAP),并对比研究其加工性能,探索了研磨液中碳化硅磨粒在固结磨料研磨垫自修整过程中的作用机理。结果表明:采用金刚石聚集体作为固结磨料垫的磨料,辅以碳化硅砂浆,能够明显提高研磨速度,改善表面加工质量。采用粒度230/270的金刚石聚集体固结磨料研磨垫,辅以颗粒尺寸3~5μm的绿碳化硅砂浆,氧化锆陶瓷研磨时材料去除率达2.5μm/min以上,表面粗糙度值Ra为74.9nm。High efficiency and low damage lapping of zirconia ceramic back is the precondition of its applications in 5 Gcommunication.The hard and brittle characteristics of zirconia materials caused serious wear of abrasive particles,so the diamond aggregation abrasives were chosen to prepare the fixed abrasive pad(FAP).A comparison of lapping performance between diamond aggregation FAP and single diamond FAP was made.The role of SiC particles in the slurry in the self-dressing process of FAP was explored.Results show that using diamond aggregation pad assisted by silicon carbide slurry,can obviously improve the lapping speed and the surface machining quality.When adopting the grain size of diamond aggregation in FAP is 230/270 and the slurry with particle size of green SiC is from 3 to 5μm,the material removal rate of zirconia ceramic can reach more than 2.5μm/min with average surface roughness Rais 74.9 nm.

关 键 词：去除速率 表面粗糙度 自修整 碳化硅砂浆 

分 类 号：TG74[金属学及工艺—刀具与模具] TG176