磁控溅射参数对Al薄膜微观结构及红外特性的影响研究  

Influence of magnetron sputtering parameter on the microstructure and infrared property of Al film

作　　者：李阳[1] 程海峰[1] 刘东青[1] 郑文伟[1] 张朝阳[1] 

机构地区：[1]国防科技大学新型陶瓷纤维及其复合材料重点实验室,长沙410073

出　　处：《化工新型材料》2017年第12期172-175,179,共5页New Chemical Materials

基　　金：国家自然科学基金(51502344)

摘　　要：利用磁控溅射法在Si(100)基片上制备了Al薄膜,采用X射线衍射、扫描电镜、扫描探针显微镜和红外光谱仪研究了基片温度、溅射功率和溅射时间对Al薄膜表面、断面形貌和红外反射率的影响。结果表明:随着基片温度的升高,Al颗粒的尺寸变大,由均匀细颗粒变为不规则形状,并逐渐熔为一个整体,断面形貌变得凹凸不平,表面粗糙度增大,红外反射率呈下降的趋势;随着溅射功率的增大,Al薄膜致密平整,表面粗糙度增大,红外反射率先增大后不变;随着溅射时间的延长,Al薄膜表面粗糙度增大,红外反射率先增大后不变。Al films were deposited on Si（100）by magnetron sputtering,XRD,SEM,AFM and infrared spectrometer were used to study the effect of substrate temperature,sputtering power and sputtering time on the surface,cross-section morphology and infrared reflectance of Al films.It showed that with the increase of substrate temperature,the size of Al particles became larger,Al particles changed from fine particles to irregular ones,and became a bulk.Its cross-section was harsh,the roughness was increased.The roughness of Al films increased,the infrared reflectance had a growing tendency and then kept stable with the increase of sputtering power.With the increase of sputtering time,the roughness of Al films inceased and the infrared reflectance had a growing tendency and then remained stable.

关 键 词：磁控溅射 Al薄膜 微观结构 红外特性 

分 类 号：TB383.2[一般工业技术—材料科学与工程]