硼硅酸盐/氧化铝复合陶瓷基板的打印制备与性能研究  

Printing and characterization of borosilicate/alumina composite ceramic substrate

作　　者：尚立艳 伍权[1] 柴永强 王士强[1] 李莹 

机构地区：[1]贵州师范大学机械与电气工程学院,贵州贵阳550025

出　　处：《电子元件与材料》2018年第2期64-68,共5页Electronic Components And Materials

基　　金：贵州省工业攻关项目(黔科合GZ字[2015]3005-01);贵州省"125计划"重大科技专项(黔教合重大专项字[2014]029);贵州省科学技术基金项目(黔科合J字[2014]2132号);贵州省优秀青年科技人才培养对象专项(黔科合人字[2015]05号)

摘　　要：基于3D打印技术,通过合理调配各材料之间的成分比例,精确控制打印参数与烧结工艺,成功制备出不同尺寸规格的硼硅酸盐/氧化铝陶瓷复合材料体系的低温共烧陶瓷(LTCC)基板,并对打印过程进行分析,对基板的微观结构、致密度以及介电性能进行了测试。结果表明:当打印速度为300 mm/min,气压为150 k Pa时打印的基板性能良好,表面粗糙度为(0.93±0.05)μm,厚度为(105±10.2)μm,在850℃烧结致密,密度可达(2.5±0.16)g/cm^3,晶粒均匀,且在2.4 GHz下测试试样的平均介电常数为5.4,介电损耗为0.0017,满足LTCC基板的使用要求。The borosilicate/alumina low temperature co-fired ceramic （LTCC） substrates with different sizes were prepared by 3D printing technology, through materials design and precise control of printing and sintering parameters. The printing process was analyzed. The microstructure, density and dielectric properties of the printed substrates were tested. The results show that the substrates can be well printed when the print speed is 300 mm/min and the pressure is 150 kPa. The average roughness of substrate is measured to be （0.93±0.05） μm, and the thickness is （105±10.2） μm. Uniform grains and high density （2.5±0.16） g/cm3 are achieved when sintered at 850 ℃. The average dielectric constant is 5.4 and the dielectric loss is 0.0017 under 2.4 GHz. The results indicate that the printed LTCC substrates basically meet the requirements for LTCC applications.

关 键 词：LTCC 浆料配置 3D打印 烧结工艺 微观结构 介电性能 

分 类 号：TN405[电子电信—微电子学与固体电子学]