电镀板面铜丝铜粒分析探讨  

Analysis of copper and copper particles on electroplated surface

作　　者：张林武 柳汉清 张林 

机构地区：[1]宏俐(汕头)电子科技有限公司,广东汕头515098

出　　处：《印制电路信息》2018年第2期59-61,共3页Printed Circuit Information

摘　　要：文章主要探讨因化学沉铜缸药水活性太高,反应剧烈,板面在化学沉铜过程中形成铜晶粒较大,导致后续图形电镀后板面形成铜丝、铜粒现象,通过试验排查及数据分析得出铜丝、铜粒产生的根源及改善方案。This paper mainly discusses the electroless copper cylinder drops due to too high activity, violent reaction and the copper grains formed because the surface of board in electroless copper form particle, which lead to the subsequent pattern plating surface to form copper particle phenomenon. Through the test investigation and data analysis, the root cause and improvement method of copper particle generation will be concluded.

关 键 词：化学沉铜 铜丝铜粒 温度 

分 类 号：TN41[电子电信—微电子学与固体电子学]