功率器件键合点外观一致性提升的方法  

A methold to improve the appearance consistency of the power devices wire bonding

作　　者：徐世明 

机构地区：[1]珠海格力新元电子有限公司,广东珠海519110

出　　处：《家电科技》2018年第1期52-54,共3页Journal of Appliance Science & Technology

摘　　要：本文提出了一种半导体行业键合工艺新的方法,力图消除键合过程中引线框架与金属基座间的共振问题,提升功率器件键合点的外观一致性。This paper presents a new methold for wire bonding process of semiconductor indust, to eliminate the resonant problem between lead frame and metal base in wire bonding process, and to improve the appearance consistency of the power devices wire bonding.

关 键 词：功率器件 键合 防震基座 

分 类 号：TN303[电子电信—物理电子学]