基于蒙特卡洛仿真的金丝键合宽带匹配研究  

Research on Broadband Matching for Wire-bonding Based on Monte Carlo Method

作　　者：于慧贤 纪学军[1] 李晓明[1] 

机构地区：[1]中国电子科技集团公司第五十四研究所,河北石家庄050081

出　　处：《石家庄铁道大学学报（自然科学版）》2018年第1期105-110,共6页Journal of Shijiazhuang Tiedao University(Natural Science Edition)

摘　　要：金丝键合是微波器件互连的重要手段,被广泛应用于系统级封装(System in Package)和多芯片组件(Multi-Chip Module)中。但随着频率的升高,金丝的引入会引起电路性能的恶化,现有的改善电路性能方法都是针对确定的键合线进行补偿,然而混合微波电路中所使用的金丝往往都是手工键合,在操作中,金丝的落点、拱高等参数都存在较大的不确定性,这就造成前述匹配方式不可能适应实际加工中的所有状况。针对实际加工中金丝键合的不确定性,提出了一种基于蒙特卡洛仿真的金丝键合宽带匹配方法,根据金丝键合落点的实测数据对人为带来的误差进行建模和分析,并将所得到的模型和参数反馈至基于Visual Basic Script语言设计的蒙特卡洛仿真器,在仿真器中针对基于统计特性的金丝键合模型进行优化,以实现对键合线的最优匹配。最后加工实物对仿真结果进行验证。在0~6 GHz范围内,匹配后的最大回波损耗相比匹配前的降低5 dB左右。Wire-bonding is an important method in microwave device interconnection widely employed in SIP and MCM.With the increase of frequency,the introduction of gold wire can lead to deterioration of circuit performance.Existing methods to improve circuit performance are to compensate for the identified bonding line.However,the gold wire used in the hybrid microwave circuit is often a manual bonding.In the operation,the parameters such as the drop point of gold wire have great uncertainty,which causes the aforementioned matching method impossible to be adapted for all situations in the actual processing.A method for the matching of bond-wire based on Monte Carlo method is proposed in view of the uncertainty of the wire bonding in actual matching.Through modeling and analysis of human error based on the measured data of the drop point of wire bonding and feedback of the obtained model and parameters to the VBS based Monte Carlo simulator,the bond-wire model based on statistical properties is optimized in the simulator,and then the optimal matching of the gold wire is realized.In the range of 0~6 GHz,the maximum echo loss after matching is about 5 dB lower than before.

关 键 词：蒙特卡洛方法 金丝键合 宽带匹配 VBS 

分 类 号：TN454[电子电信—微电子学与固体电子学]