电源/地平面中过孔转换的低阶电路模型研究  

Research on Low-order Circuit Models for Via Transition in Power/Ground Planes

作　　者：胡玉生 

机构地区：[1]集美大学机械与能源工程学院

出　　处：《安全与电磁兼容》2018年第1期53-56,共4页Safety & EMC

基　　金：福建省科技计划项目(2017I0011);厦门市科技计划项目(3502Z20154096)

摘　　要：讨论了多层印制电路板中过孔通过电源/地平面时的几种等效电路模型。为便于了解过孔等效电路建模的机理,仅考虑了包含电容的低阶电路模型。分析了过孔转换结构的寄生参数电路模型和传输线电路模型,以及电源/地平面中过孔之间的串扰耦合问题,提出了一种基于三端口网络的新的过孔电路模型,并以数字信号为例对各电路模型进行了仿真分析。所得结果有助于提取过孔转换结构的等效电路模型,了解过孔转换结构影响信号完整性的机理。Several types of equivalent circuit model for vias through a pair of power/ground planes in multilayer printed circuit board were discussed. For briefly understanding the modeling mechanism for via using equivalent circuit method, the low-order circuit model, which includes only capacitance, is considered. The parasitic parameters circuit model, transmission line circuit model, as well as the crosstalk coupling among vias in power/ground planes were analyzed, and a new three-port network based circuit model were introduced, furthermore, simulations and analysis were performed for all the circuit models for digital signal. The obtained results are contributive to extract the equivalent circuit models for via transition, and to understand the mechanism that via transition impacts the signal integrity.

关 键 词：信号完整性 多层PCB 过孔 电源/地平面 串扰 等效电路 

分 类 号：TN41[电子电信—微电子学与固体电子学]