基于超临界流体电铸耦合场分析及试验研究（英文）  

Simulation of Electrodepositing Process Based on Supercritical Fluid and Test Research

作　　者：钱海峰[1] 雷卫宁[1,2] 刘维桥 谈衡 沈宇[1] Qian Haifeng1, Lei Weining1,2, Liu Weiqiao2, Tan Heng1,2, Shen Yu1(1 Jiangsu University of Technology, Changzhou 213001, China; 2 Jiangsu Key Laboratory for Green Forming and Equipment of High Performance Materials, Changzhou 213001, Chin)

机构地区：[1]江苏理工学院,江苏常州213001 [2]江苏省高性能材料绿色成形与装备重点实验室,江苏常州213001

出　　处：《稀有金属材料与工程》2018年第3期717-722,共6页Rare Metal Materials and Engineering

基　　金：National Natural Science Foundation of China(51275222);Natural Science Foundation of Jiangsu Province(BK20161198)

摘　　要：利用COMSOL Multiphysics对超临界流体电铸耦合场进行数值模拟,研究分析电流密度分布和电铸层生长规律,并且试验测试与验证;同时对超临界流体镍纳米金刚石复合镀层的表面形貌和显微硬度进行研究和探讨。结果表明,阴极边缘处电流密度远高于阴极中间部分,电铸层生长情况与电流密度分布较为吻合,电铸层中部厚度预测值的误差较小;电铸层显微硬度HV最大可达9540 MPa,比普通情况下复合铸层提高80%;制备的复合电铸层表面平整,组织致密。The coupling field of electrodepositing process under the supercritical fluid was simulated by COMSOL Multiphysics software to study the distribution of the current density and the growth of the electrodepositing coating which was verified by the experimental supercritical composite electrodepositing coating.Simultaneously the surface morphology and microhardness of the experimental supercritical nickel-diamond electrodepositing coating were studied.The results show that the current density on cathodic edge is much higher than that of the middle section and the predicted growth of the electrodepositing coating accords with current density distribution.The error between predicted and experimental thickness of the central supercritical electrodepositing coating is smaller.The biggest microhardness HV of the composite supercritical electrodepositing coating can reach 9540 MPa（200 g）,80% higher than that of ordinary composite electrodepositing coating.The supercritical composite electrodepositing coating has smooth surface and compact structure.

关 键 词：电铸 超临界流体 耦合模拟 硬度 厚度 

分 类 号：TQ153.4[化学工程—电化学工业]