湿热试验后化学镀镍磷合金层起泡原因分析  

Analysis of Foaming Feason of Electroless Ni-P Alloy Layer after Damp Heat Test

作　　者：唐缨[1] TANG Ying(Sichuan Jiuzhou Electric Group Co. Ltd., mianyang 621000, China)

机构地区：[1]四川九洲电器集团有限责任公司,四川绵阳621000

出　　处：《电子工艺技术》2018年第2期113-115,124,共4页Electronics Process Technology

摘　　要：化学镀镍磷合金层因具有良好的耐蚀、可焊和磁性质等优点被广泛运用于电子产品中。在产品环境试验中如果出现化学镀镍磷层起泡现象,将降低镀层对基材的防护性,影响产品的交付。为了解决环境试验湿热试验后铝合金腔体表面化学镀镍磷合金层出现起泡问题,对影响镀层质量的温度、p H值、时间和槽液组成等主要电镀工艺参数进行了分析和排查。通过孔隙率测试最终确定了镀层起泡的原因为槽液老化所致,并提出了工艺改进措施。Electroless Ni-P alloy coating has been widely used in the design of electronic products because of its good corrosion resistance, weldability, magnetic properties and so on.In the product environmental test, if there is a phenomenon of electroless nickel phosphorus layer foaming, it will reduce the protection of the coating on the substrate, and affect the delivery of the product. In order to solve the blistering problem of Electroless Ni-P alloy coating on aluminum alloy cavity afterdamp heat test, the main plating parameters such as temperature, p H, time and composition of bath were analyzed and investigated. The blistering problem was determined by the porosity test, which was caused by the aging of the bath. Process improvement measures are put forward.

关 键 词：化学镀镍磷合金 耐蚀性 起泡 孔隙率 

分 类 号：TQ153[化学工程—电化学工业]