大口径光学元件的精密磨抛与检测装备开发及应用  

Development and Application of Precision Grinding/Polishing and Measurement Equipment for Large-Size Optical Components

作　　者：郭隐彪[1] 彭云峰[1] 王振忠[1] 毕果[1] 杨炜[1] 杨平[1] GUO Yinbiao;PENG Yunfeng;WANG Zhenzhong;BI Guo;YANG Wei;YANG Ping(Micro/Nano Machining and Measuring Laboratory, Xiamen University, Xiamen 361005, China)

机构地区：[1]厦门大学微纳米加工与检测联合实验室,厦门361005

出　　处：《航空制造技术》2018年第6期26-35,共10页Aeronautical Manufacturing Technology

基　　金：国家自然科学基金项目(51675453);深圳科技计划项目(JCYJ 20160517103720819)

摘　　要：大口径光学元件超精密加工是一个复杂的系统性工程,涉及精密机床、数控、加工技术与工艺、精密检测和补偿控制等机电控各领域的专业知识,其发展与一个国家的高端制造技术及装备发展能力息息相关,也是一个国家综合国力的集中体现。主要介绍了厦门大学微纳米加工与检测联合实验室在大口径光学元件超精密加工技术及装备方面取得的研究进展,针对大口径光学元件磨削和抛光两个加工流程及其配套的精密检测技术,详细阐述了磨削装备及单元技术、可控气囊抛光机床及相关单元技术、精密检测装备及相关单元技术等的研究应用情况。这些技术研究从超精密加工的需求出发,借鉴国内外的研究经验和成果,通过对装备、工艺、检测等各方面整合,形成了具有自主知识产权的集磨削、抛光和检测装备及工艺技术的大口径光学元件超精密加工体系,这些技术与装备确保了大口径光学元件的高质量超精密加工。The ultra-precision manufacturing of large-size optical component is a complex system engineering that is related to the precision machine, numerical control, manufacturing technique, precision metrology and compensation, all of which depend on the development of the mechanical-electrical-control theory. In this paper, the researching progress in Department of Mechanical and Electrical Engineering of Xiamen University has been presented, which mainly focuses on the development of precision grinding machine and bonnet polishing machine together with the corresponding measuring equipment.

关 键 词：大口径光学元件 超精密加工 磨削加工装备 气囊抛光 精密检测 磨床 

分 类 号：TH74[机械工程—光学工程]