一种嵌入式散热PCB的制作过程  

The fabrication process of an embedded PCB for heat radiation

作　　者：彭喜儿 杨杰 关志锋 李超谋 PENG Xi-er;YANG Jie;GUAN Zhi-feng;LI Chao-mou

机构地区：[1]珠海杰赛科技有限公司,广东珠海519170 [2]广州杰赛电子有限公司,广东广州510032 [3]广州杰赛科技股份有限公司,广东广州510310

出　　处：《印制电路信息》2018年第4期59-62,共4页Printed Circuit Information

摘　　要：PC B在大功率运行下产生大量的热量,如何高效、便捷地为电子器件散热降温已成为关乎产品系统设计关键问题。本文介绍了一种采用铝基散热的嵌入式PCB的开发过程并分享了一套最优的产品实现方案。As PCB products operated in high power generated a lot of heat, high temperature failure has become the main problems of product failure. How to cool electronic devices efficiently and effectively has become a key issue in products design. This paper introduces a development process of an PCB which has embedded aluminum substrate for heat dissipation, and shares a set of optimal product realization plan.

关 键 词：嵌入式 铝基板 散热板 

分 类 号：TN41[电子电信—微电子学与固体电子学]