基于LTCC基板温度载荷条件下失效的仿真分析  

Simulation Analysis of Failure Based on Temperature Loading of LTCC Substrate

作　　者：王天石[1] 时生淦 马洪波[2] 刘洋志[1] 张怡[1] 邓超 WANG Tian-shi;SHI Sheng-gan;Ma Hon-gbo;LIU Yang-zhi;ZHANG Yi;DENG Chao(The 29th Research Institute,CETC,Chengdu Sichuan 610036,China;School of Mechano-Electronic Engineering,Xidian University,Xi’ an Shaanxi 710071,China)

机构地区：[1]中国电子科技集团公司第二十九研究所,四川成都610036 [2]西安电子科技大学机电工程学院,陕西西安710071

出　　处：《装备制造技术》2018年第3期204-208,共5页Equipment Manufacturing Technology

基　　金：国防科工局技术基础科研资助项目(JSZL2015210B007)

摘　　要：针对低温共烧陶瓷(LTCC:low temperature co-fired ceramic)基板温度载荷条件下出现裂纹从而引起失效的问题进行研究,建立LTCC基板与盒体的有限元模型,根据LTCC基板的载荷条件采用热结构耦合仿真分析。将分析结果与LTCC基板失效位置进行对比,查看在裂纹产生次数较多位置的应力集中情况,对LTCC基板失效原因进行分析,为LTCC基板的结构优化提供依据与支持。Aiming at the problem of lose efficacy caused by the crack under the temperature load condition of LTCC substrate,a finite element model of the LTCC substrate and the box body is established. According to the load conditions of the LTCC substrate,a thermal structure Coupling simulation analysis is adopted. The simulation analysis results are compared with the invalid location of the LTCC substrate. The stress concentration in the locations with more cracks is examined. The failure causes of the LTCC substrate are analyzed to provide the basis and support for the structural optimization of the LTCC substrate.

关 键 词：LTCC基板 温度载荷 失效位置 仿真分析 

分 类 号：TN621[电子电信—电路与系统]