低剖面渐变槽线天线单元印制板制造工艺  

Manufacturing Technology of Microwave Multi-layer PCB in Low Profile Tapered Slotline Antenna

作　　者：王伟[1] 周峻松[1] 杨金卓[1] 奚洋[1] WANG Wei;ZHOU Jun-song;YANG Jin-zhuo;XI Yang(Nanfing Research Institute of Electronics Technology, Nanjing 210039, China)

机构地区：[1]南京电子技术研究所,江苏南京210039

出　　处：《电子机械工程》2018年第2期44-46,共3页Electro-Mechanical Engineering

摘　　要：微波多层印制板制造技术是实现有源相控阵雷达低剖面渐变槽线天线单元的关键技术。文中介绍了为解决印制板基材与金属化孔热膨胀系数差异问题以及多阶台阶结构层压问题而开展的微波多层印制板基材匹配技术和多阶台阶结构层压技术。选用合理的层压温度、压力、时间和阻胶技术,实现了高质量的微波多层印制板制造,同时引入金属化孔加固技术进一步提高了可靠性。研究结果表明,上述技术为相控阵雷达实现优异的宽带宽角扫描驻波性能及低剖面提供了可能,并且可供此类微波多层印制板的制造借鉴。Manufacturing technology of microwave multi-layer PCB is one of the key technologies of APAR low profile tapered slotline antenna. To solve the mismatching problem of substrate coefficient of thermal expansion(CTE） between PTFE copper-clad laminate(CCL） and plating through hole(PTH） copper layer and the laminating problem of this kind of multilevel steps microwave multi-layer PCB,the matching technology of CCL substrates and laminating technology of PCB with multilevel steps structure are introduced in this paper.The microwave multi-layer PCB with high quality is obtained by optimizing laminating parameters of temperature,pressure and time and adopting resin prohibited technology. The reliability of PCB is improved by PTH reinforcement technology. These technologies make it possible for the active phased array radar antenna to achieve excellent wide-angle broadband scanning performance,excellent standing-wave performance and low profile structure and can be used as reference for the manufacturing of similar microwave multi-layer PCB.

关 键 词：渐变槽线天线 微波多层印制板 电镀通孔加固 

分 类 号：TN41[电子电信—微电子学与固体电子学]