半导体激光辅助治疗慢性牙周炎的临床效果  

Clinical evaluation of diode laser assisted treatment of chronic periodontitis

作　　者：张丽娟[1] 石晶[1] 郭杰华[1] 张娜[1] ZHANG Lijuan;SHI Jing;GUO Jiehua;ZHANG Na(030012 Taiyuan, Department of Oral Medicine, Shan Xi Provineal People Hospital, China)

机构地区：[1]山西省人民医院口腔内科,太原030012

出　　处：《实用口腔医学杂志》2018年第3期404-406,共3页Journal of Practical Stomatology

摘　　要：目的:评估半导体激光作为辅助手段在治疗慢性牙周炎的短期临床效果。方法:18名慢性牙周疾病患者,洁治后2周作为基线。应用分口设计法,同颌对称同名患牙随机分组:实验组(超声龈下刮治+手工根面平整+半导体激光治疗组),对照组(超声龈下刮治+手工根面平整治疗组),每组52颗牙齿。用视觉模拟评分法(VAS)记录患者治疗过程中疼痛情况;对基线,治疗后1个月和3个月由另外一名不知道实验设计的专业牙周科医生进行牙周检查,包括菌斑指数(PLI),牙龈出血指数(BI),牙周探诊深度(PD),牙周临床附着丧失(CAL)情况。结果:实验组患者VAS明显低于对照组(P<0.01);治疗后1个月和3个月2组的PD、CAL、BI、PLI较基线都明显降低(P<0.001),且实验组在每个复查时间点的PD、CAL、BI较对照组明显降低(P<0.001)。结论:半导体激光作为辅助手段治疗慢性牙周炎可以减轻患者在牙周龈下刮治和根面平整时疼痛,并且临床治疗效果更佳。Objective： To evaluate short-term clinical effects of diode laser as an adjunctive therapy in the treatment of chronic periodontitis. Methods： 104 teeth in 18 patients with chronic periodontitis were divided into 2 groups （n = 52） by split-mouth design 2 weeks after periodontal scaling. The teeth in test group were treated by a combination of diode lase with ultrasonic subgingival scaling and root planing, in control group by subgingival scaling and root planing. The degree of treatment pain was recorded by VAS. The clinical outcomes were examed by a blinded periodontal physician, and evaluated by plaque index （PLI）, bleeding index （BI）, probing pocket depth （PD） and chnical attachment loss （CAL） at baseline, 1 and 3 months after treatment. Results： The VAS in test group was lower than that in control group（ P 〈 0.01 ）. 1 month and 3 months after treatment PD, CAL, BI and PLI were decreased in both groups （ P 〈 0.001 ）, PD, CAL and BI in test group were lower than those in the control （ P 〈 0. 001 or P 〈 0.05 ）. Conclusion ： Diode laser as an adjunctive therapy may relieve the pain during subgingival scaling and root planning, and improve the treatment outcome.

关 键 词：半导体激光 慢性牙周炎 龈下刮治 根面平整 

分 类 号：R781.42[医药卫生—口腔医学]