复合型配位剂无氰碱性光亮镀铜的研究  

Cyanide-Free Bright Copper Electroplating by Complexing Type Coordination Agent

作　　者：左正忠[1] 付远波 付艳梅 潘琦 宋文超 喻超 叶昌松 ZUO Zheng-zhong;FU Yuan-bo;FU Yan-mei;PAN Qi;SONG Wen-chao;YU Chao;YE Chang-song(College of Chemistry and Molecular Sciences, Wuhan University, Wuhan 430072, China;Wuhma Oxiran Special Chemicals Co., Ltd., Wuhan 430076, China)

机构地区：[1]武汉大学化学与分子科学学院,湖北武汉430072 [2]武汉市奥克特种化学有限公司,湖北武汉430076 [3]中国表面工程协会设备材料委员会,湖北武汉430015

出　　处：《材料保护》2018年第5期90-93,共4页Materials Protection

摘　　要：为了开发无氰碱性光亮镀铜工艺,通过采用复合型配位剂OJ-c进行无氰碱性光亮镀铜,研制了新的光亮剂及整平剂。通过电化学方法测试了阴极极化曲线,并利用旋转圆盘电极研究了镀液的整平性能。结果表明:复合型配位剂OJ-c对Cu^(2+)的配位能力强,镀液稳定,分散能力好,阴极电流效率达80%;所得铜镀层光亮、细致、均匀、整平性好,可直接在其上镀Ni、Cr。推荐的镀液组成及操作条件:Cu_2(OH)_2·CO_335~45 g/L,OJ-c(复合配位剂)80~110 g/L,K_2SO_440~50 g/L,OJ-b(光亮剂)3~5 g/L,OJ-l(整平剂)1.0~1.5 m L/L;CB-n(铜置换抑制剂)0.01~0.05 mg/L,θ35~45℃,pH值8.0~9.5,Jc0.2~2.0 A/dm^2;阳极:Cu或P-Cu板(含P 0.03%~0.05%);空气搅拌。Cyanide-free bright copper plating was carried out with complexing type coordination agent OJ-c, and the new brightener and level- ing agent were studied. The cathode polarization curve was tested by electrochemical method, and the method of rotating disk electrode was used to study the leveling property of the bath. Results showed that the complexing type coordination agent OJ- c had good coordinating ability to Cu2＋. The bath was stable and the dispersing ability was good. Moreover, the cathodic efficiency was up to 800/0. The obtained copper coating was bright, fine, smooth and uniform with good leveling, which was suitable for the direct plating of nickel or chromium layers. The recommen- ded plating bath composition and operating conditions were as follows： C%（OH） 2CO3 35-45 g/L,OJ-c 80- 110 g/L, K2SQ 40-50 g/L, OJ-b 3-5 g/L, OJ-1 1.0-1.5 mL/L,copper replacement inhibitor （CB-n）0.01-0.05 nag/L; θ 35-45 ℃ ,pH value 8.0-9.5,J, 0.2-2.0 A/dmz, copper or P - copper（ P 0.03 % - 0.05 %） as anode ; besides, air agitation was needed.

关 键 词：无氰镀铜 复合型配位剂 光亮剂 整平剂 电化学行为 

分 类 号：TQ153.2[化学工程—电化学工业]