激光划片机的晶圆自动对准方法研究  

Research of Turning Alignment Silicon Wafer Automatically On Laser Cutting System

作　　者：张乾[1] 张永昌 邓胜强 谭立杰[1] ZHANG Qian;ZHANG Yongchang;DENG Shengqiang;TAN Lijie(The 45th Research Institute of CETC, Beijing 100176, China)

机构地区：[1]中国电子科技集团公司第四十五研究所,北京100176

出　　处：《电子工业专用设备》2018年第3期24-27,63,共5页Equipment for Electronic Products Manufacturing

摘　　要：针对激光划片机的自动化生产需求,通过图像识别与模板匹配策略,在底部对准的激光划片机上实现GPP晶圆的自动旋转对位,并通过建立网格节点的方式计算划片轨迹,实现晶圆正面图形的自动识别与划片。Be aimed to achieve the need of automation of laser cutting machine, the strategy of image recognition and template matching is provided in this paper. To accomplish image recognition automatically and cutting automatically on laser cutting system which aligns GPP wafer from bottom,automatic rotation alignment and calculating cutting path by matching grid nodes are introduced.

关 键 词：激光划片机 图像识别 底部对准 玻璃钝化(GPP)晶圆 

分 类 号：TN305.1[电子电信—物理电子学]