纳米SiO_2改性环氧粘接剂工艺试验研究  

Study on Epoxy Adhesive Modified by Nano Silica

作　　者：王玉龙[1] 王碧瑶 孙慧[1] 张伟[1] WANG Yulong;WANG Biyao;Sun Hui;Zhang Wei(Changchun Institute of Optics, Fine Mechanics and Physics, Chinese Academy of sciences, Changchun 130033, China;University of Jinan, Jinan 250000, China)

机构地区：[1]中国科学院长春光学精密机械与物理研究所,吉林长春130033 [2]济南大学,山东济南250000

出　　处：《电子工艺技术》2018年第3期140-143,共4页Electronics Process Technology

基　　金：国家自然科学基金项目(项目编号:61036015)

摘　　要：纳米材料具有量子尺寸效应、表面效应以及量子隧道效应等特点,当使用纳米SiO_2对环氧粘接剂改性后,可在一定程度上提高环氧胶对基体的粘接强度,降低内应力和膨胀系数,从而达到增强和增韧的效果,这对于宇航产品中PCB组件粘固可靠性是有益的。试验研究发现:当纳米SiO_2填料在3M-2216环氧胶中掺杂质量分数达到3%和4%时,其钢-钢剪切强度达到最大值(分别为13.79 MPa和13.63 MPa),膨胀系数降低到原来的约50%,并且诱发银纹的效果明显,这种改性后的性能较为适宜于实际工程应用。Nanomaterials have the characteristics of quantum size effect, surface and quantum tunneling effect. The epoxy adhesive modified by nano silica can improve the bonding strength of the epoxy matrix in a certain extent, so as to achieve the effect of strengthening and toughening, which is intended for aerospace products PCB component bonding reliability. The study found that when the nano silica filler in epoxy 3 M-2216 doping ratio reached 3% and 4%, the steel-steel shear strength reaches the maximum value（13.79 MPa and 13.63 MPa）, the expansion coefficient decreases to about 50% of the original, and the effect of inducing silver stripe is obvious, the performance modification of this more suitable for practical engineering application.

关 键 词：纳米SIO2 改性 环氧 宇航产品 PCB组件 粘固 

分 类 号：TN60[电子电信—电路与系统]