沉金PCB焊盘不润湿问题分析方法研究  

Research on Analysis Method of Non-wetting Problem of ENIG

作　　者：安维[1] 李敬科[1] 曾福林[1] AN Wei;LI Jingke;ZENG Fulin(Zhongxing Telecommunication Equipment Corporation, Shenzhen 518057, China)

机构地区：[1]中兴通讯股份有限公司,广东深圳518057

出　　处：《电子工艺技术》2018年第3期154-156,178,共4页Electronics Process Technology

摘　　要：随着无铅化产业的推进,沉金工艺作为无铅适应性的一种表面处理已经成为无铅表面处理的主流工艺。无铅焊接峰值温度的提高,带来了更复杂的焊盘不润湿问题,给企业正常生产造成很大困扰。重点针对沉金PCB无铅焊接焊盘不润湿的问题进行了深入研究,整理了一套完整的焊盘不润湿问题的分析方法。为企业解决沉金PCB焊盘不润湿问题提供了有力的分析方法和手段。As one of the lead-free PCB sur face treatment process, the elec troless nickel/immersiongold（ENIG） was more and more popular in electrical industrial by more end customers because of its advantage. With the increase of the peak temperature of lead-free solder, the problem of non-wetting of the more complicated soldering disk is brought, which causes a great disturbance to the normal production of the enterprise. Focus on the problem of non-wetting of the lead-free soldering plate of ENIG, and probe into the analysis method of a complete set of non-wetting problems. It provides a strong analytical method and means for the enterprise to solve the non-wetting problem.

关 键 词：PCB 沉金 不润湿 

分 类 号：TN41[电子电信—微电子学与固体电子学]