一种射频系统的三维系统级封装设计与实现  

Design and Implementation of a 3D System-in-Package for RF System

作　　者：王健[1,2,3] 吴鹏 刘丰满[1,3] 周云燕 李君[1,3] 万里兮 WANG Jian;WU Peng;LIU Feng-man;ZHOU Yun-yan;LI Jun;WAN Li-xi(Microsystem Packaging Research Center, Institute of Microelectronics of Chinese Academy of Sciences, Beijing 100029, China;University of Chinese Academy of Science, 13eijing 100049, China;National Center for Advanced Packaging（NCAP）, Wuxi 214135, China)

机构地区：[1]中国科学院微电子研究所系统封装与集成研发中心,北京100029 [2]中国科学院大学,北京100049 [3]华进半导体封装先导技术研发中心有限公司,江苏无锡214135

出　　处：《微电子学与计算机》2018年第7期87-91,共5页Microelectronics & Computer

基　　金：国家高技术研究发展计划("八六三"计划)(2015AA016904)

摘　　要：三维封装已经成为实现电子系统进一步集成化的主要方式.为了满足射频收发系统的小型化需求,通过采用柔性基板进行三维垂直互连,设计并实现了一种射频系统的三维系统级封装,封装尺寸为50mm*52.5mm*8mm,相比于原版,尺寸减小近20倍.同时利用HFSS和SIwave软件对系统进行了信号完整性(SI)和电源完整性(PI)设计,并进行优化.仿真结果表明:关键时钟走线插入损耗低于0.31dB,回波损耗大于22dB,眼图质量良好,并且电源分配网络(PDN)阻抗等均满足系统设计要求.3D packaging has become the important way for the further integrate of electronic systems. In order to meet the miniaturization requirements of radio frequency system, a 3D System-in-Packaging （SIP） of RF system is designed and implemented by using flexible substrate as three-dimensional vertical interconnectioru The size of the package is 50mm＊ 52.5mm ＊ 8mm, almost reducing the area 20 times compare to the prototype. HFSS and SIwave are used to design and optimize the signal integrity （SI） and power integrity （PI） of the system. The simulation results show that the insertion loss of the critical clock is less than 0. 31dB, the return loss is more than 15 dB, and the eye quality is good. Meanwhile, the Power distribution network （PDN） impedance meets the design requirements.

关 键 词：信号完整性 电源完整性 射频系统 三维封装 

分 类 号：TN405[电子电信—微电子学与固体电子学]