一种应用于宽带接收机射频前端多芯片模块的外壳设计  

The Design of Multi-chip Package Applied in Wide Band Receiver RF Front-end

作　　者：龚锦林 李永彬[1] GONG Jinlin;LI Yongbin(Nanjing Electronic Devices Institute, Nanjing, 210016, CHN)

机构地区：[1]南京电子器件研究所,南京210016

出　　处：《固体电子学研究与进展》2018年第3期210-213,共4页Research & Progress of SSE

摘　　要：设计了一款用于封装宽带接收机射频前端多芯片模块的外壳。利用HFSS软件在多层陶瓷内部优化设计相邻腔体之间射频(RF)信号低损耗传输结构,并在各腔体之间优化设置接地通孔,实现多个芯片在一个外壳内的气密封装与良好电气互连,同时各腔体之间具有较高的隔离度,能够有效防止信号之间的电磁串扰。测试结果表明,在10 MHz^20GHz的范围内,插入损耗小于0.5dB,回波损耗大于15dB,隔离度大于50dB。In this paper,a multi-chip package for the application of wide band receiver RF front-end was presented.Through the simulation of HFSS software,an RF transmission line structure between adjacent cavities in multilayer ceramic was designed with low loss,and the GND via holes between cavities were set to realize the package and interconnection of several chips.It is featured by well isolation suppressing the leakage of electromagnetic energy and satisfying the requirement of EMC.The measurement results shows that there is an insert loss lower than 0.5 dB,a return loss better than 15 dB,and an isolation better than 50 dB in the frequency band from 10 MHz to 20 GHz.

关 键 词：多芯片封装 电磁兼容 共面波导 小型化 

分 类 号：TN454[电子电信—微电子学与固体电子学]