RE及Ni对Zn20Sn高温无铅钎料显微组织及性能的影响  

Influence of RE and Ni on Microstructure and Properties of Zn20Sn High-temperature Lead-Free Solder

作　　者：李小军 田君 戴品强[1,2] 王海燕[2] Li Xiaojun;Tian Jun;Dai Pinqiang;Wang Haiyan(Fuzhou University, Fuzhou 350108, China;Fujian University of Technology, Fuzhou 350108, China)

机构地区：[1]福州大学,福建福州350108 [2]福建工程学院,福建福州350108

出　　处：《稀有金属材料与工程》2018年第6期1860-1865,共6页Rare Metal Materials and Engineering

基　　金：福建省科技厅资助项目(2015H0008)

摘　　要：在Zn20Sn高温无铅钎料合金中添加0.1%RE及0.2%~0.8%Ni(质量分数,下同),研究了RE及Ni对钎料合金显微组织及性能的影响。结果表明,在Zn20Sn中同时添加0.1%RE及0.2%~0.8%Ni后,钎料合金的固相线变化不大,而液相线温度降低;RE及Ni对钎料合金的润湿性能及显微硬度有明显的影响,当RE为0.1%、Ni为0.4%时,钎料合金的润湿性能最好、显微硬度最高;随着RE及Ni的添加,在钎料合金中形成了含Ni金属间化合物,且随着Ni含量的提高,金属间化合物的形状、钎料合金的组织结构发生显著变化。0.1 wt% RE and 0.2 wt%-0.8 wt% Ni were added into Zn20Sn high-temperature lead-free solders. The effects of RE and Ni additions on the microstructure and properties of the solder alloys were investigated. The results show that the solidus temperature of solder alloys is not distinctly affected when the 0.1 wt% RE and 0.2 wt%-0.8 wt% Ni are added into Zn20Sn solder alloys, whereas the liquidus temperature decreases, the wettability and microhardness significantly improve. The solder alloy shows the best wettability and the highest microhardness when the content of RE is 0.1 wt% and Ni is 0.4 wt%. Ni-containing intermetallic compounds form in solder alloys and the amount of intermetallic compounds gradually increases with increasing Ni content, and the shape of intermetallic compounds and the microstructure of solder alloys change markedly.

关 键 词：无铅钎料 Zn20Sn 显微组织 性能 

分 类 号：TG425.1[金属学及工艺—焊接]