压敏胶在电子产品中的应用研究进展  

Progress of pressure-sensitive adhesives applied in electronic products

作　　者：申豪杰 高壮 陈文求[2] 李桢林[2] 尤庆亮[1] 范和平[1,2] SHEN Hao-jie;GAO Zhuang;CHEN Wen-qiu;LI Zhen-lin;YOU Qing-oiang;FAN He-ping(Key Laboratory of Optoelectronic Chemical Materials and Devices,Ministry of Education,School of Chemical and Environmental Engineering,Jianghan University,Wuhan,Hubei 430056,China;HAISO Technology Co.Ltd.,Wuhan,Hubei 430074,China)

机构地区：[1]光电化学材料与器件教育部重点实验室,化学与环境工程学院,江汉大学,湖北武汉430056 [2]华烁科技股份有限公司,湖北武汉430074

出　　处：《粘接》2018年第6期61-64,76,共5页Adhesion

基　　金：江汉大学研究生科研创新基金资助(015-2016-03)

摘　　要：介绍了近几年压敏胶在电子组/封装、保护、导电及电磁屏蔽、导热等方面实际应用的研究现状,展望了其在电子产品应用中的发展趋势。The recent several commonly practical applications of pressure-sensitive adhesives in the electronic products,including electronic assembly/packaging,protective films,electric conduction or electromagnetic shielding,as well as heat conduction,were emphatically introduced.The future research and application trends were also proposed.

关 键 词：压敏胶 电子组装/封装 导电 电磁屏蔽 导热 

分 类 号：TQ436.3[化学工程]