表面活性剂对无铅锡膏焊接效果的影响  

Influence of Surfactant on the Soldering Effect of Lead-free Solder Paste

作　　者：谢鹏 张宇航 韩振峰 孙福林 戴贤斌 蔡志红 吴家前 XlE Peng;ZHANG Yu-hang;HAN Zhen-feng;SUN Fu-lin;DAI Xian-bin;Cai Zhi-hong;WU Jia-qian(Guangdong Welding Institute（China-ukraine E.O.Paton Institute of Welding）,Guangzhou 510651,Guangdong,China)

机构地区：[1]广东省焊接技术研究所(广东省中乌研究院),广东广州510651

出　　处：《铜业工程》2018年第3期24-26,39,共4页Copper Engineering

基　　金：广东省现代焊接技术重点实验室(2017B030314048);广东省科技计划项目(2017B090901071);广州市科技计划项目(201704030113)

摘　　要：选用三种不同类型的表面活性剂,配制成三种无铅锡膏,通过铺展率测试与与观察样品焊点外貌,研究表面活性剂对无铅锡膏焊接效果的影响,结果表明:表面活性剂EB-9能够有效提高无铅锡膏焊接效果。研究表面活性剂EB-9的含量对无铅锡膏焊接效果的影响,通过铺展率测试以及铜板腐蚀性实验,确定最优的使用量,结果表明:当表面活性剂EB-9使用量为1%时,无铅锡膏焊接效果最优。Choose three different types of surfactant,compound three lead-free solder pastes. Through spreading rate testandobserving the appearance,studying on the influence of surfactant on the soldering effect of lead-free solder paste.The results show： surfactant EB-9 can effectively improve the soldering effect.Study on the influence of surfactant EB-9 content on the soldering effect of lead-free solder paste. Through spreading rate test and copper corrosion test, the optimal amount can be determined.The results show：when the amount of surfactant EB-9 is 1%,the lead-free solder paste has the best soldering effect.

关 键 词：表面活性剂 锡膏 焊接 铺展率 效果 腐蚀 

分 类 号：TG44[金属学及工艺—焊接]