电镀金刚线技术探讨  

Discussion on electroplating diamond wire technology

作　　者：王宝玉 宋为 张太超[2] Wang Baoyu;Song Wei;Zhang Taichao(Sinosteel Zhengzhou Research Institute of Steel Wire Products Co.,Ltd.,Zhengzhou 450001,China;Zhongyuan University of Technology,Zhengzhou 450007,China)

机构地区：[1]中钢集团郑州金属制品研究院有限公司,河南郑州450001 [2]中原工学院,河南郑州450007

出　　处：《金属制品》2018年第3期10-13,共4页Metal Products

摘　　要：介绍金刚线特点和市场状况,从光伏发电量、硅片切割需求量、单晶硅和多晶硅切割时金刚线的占有率,预测2018年金刚线总体需求。对金刚线母线的原料、工艺流程、生产设备和主要工艺进行研究,说明电镀金刚线时的主要影响因素及控制要点,提出行业发展应关注的几个问题。To introduce the characteristic and market condition of the diamond wire. The total demand for diamond wire in2018 is predicted from the PV generation,silicon chip cutting demand,and the share of diamond lines in monocrystalline silicon and polysilicon cutting. The raw material,process flow,production equipment and main process of the master wire are studied. The main influencing factors and control points of the electroplating diamond wire are explained,and the problems that should be paid attention to in the development of the industry are put forward.

关 键 词：硅片 母线 电镀金刚线 金刚石微粉 

分 类 号：TG356.27[金属学及工艺—金属压力加工]