表面贴装封装发光二极管的结构设计  被引量:2

Structure design of LED in surface mount package

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作  者:詹前靖 刘小勤 侯再红[1] 袁怿谦[1] 吴毅 Zhan Qianjing;Liu Xiaoqin;Hou Zaihong;Yuan Yiqian;Wu Yi(Key Laboratory of Atmospheric Composition and Optical Radiation,Anhui Institute of Optics and Fine Mechanics,Hefei Institutes of Physical Sciences,CAS,Hefei 230031,China;University of Science and Technology of China,Hefei 230026,China)

机构地区:[1]中国科学院合肥物质科学研究院安徽光学精密机械研究所大气成分与光学重点实验室,安徽合肥230031 [2]中国科学技术大学,安徽合肥230026

出  处:《应用光学》2018年第4期556-562,共7页Journal of Applied Optics

摘  要:为了提高表面贴片封装(SMD)发光二极管(LED)封装结构的封装效率,根据LED的光学结构和性质,建立了简化的SMD LED封装结构模型,并实现了LED封装结构的连续自动生成、仿真和优化。仿真结果表明:在色温相同的条件下,光通量和辐射通量呈线性关系,侧壁的改变会造成白光光通量先增加后减少的趋势。通过对3款不同侧壁张角的LED进行测试,测试结果与仿真结果光通量趋势相同,并得到了对于这种封装方式的最佳侧壁张角为60°的结论,验证了仿真的正确性。In order to improve the packaging-structure efficiency of the surface mount package(SMP)light emitting diode(LED)packaging-structure,the simplified model of SMP LED packaging-structure was established as well as realized the continuous automatic generation,simulation and optimization of LED packaging-structure.The results show that under the same color temperature condition,there is a linear relationship between the luminous flux and the radiation flux,and the change of the side wall can cause the light flux first increased and then decreased.Beside,by testing three kinds of LEDs with different side wall angles,the trends of the luminous flux are identical both in the simulation results and the test results,and it is concluded that the optimal side wall angle is 60°for this type of packaging,which verify the correctness of the simulation.

关 键 词:发光二极管 表面贴片封装 封装结构 发光效率 

分 类 号:TN304[电子电信—物理电子学]

 

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