利用外部电阻法进行瞬态热测试的方法研究  

Measuring thermal resistance for transient thermal test by applying external resistor

作　　者：赵青[1] 胡家渝[1] ZHAO Qing;HU Jiayu(Southwest China Institute of Electronic Technology,Chengdu 610036,China)

机构地区：[1]西南电子技术研究所,四川成都610036

出　　处：《电子元件与材料》2018年第7期35-39,共5页Electronic Components And Materials

摘　　要：在瞬态热测试方法中,由于T3ster测试仪本机的驱动能力有限,不能直接对大功率半导体器件进行驱动;如果采用小功率半导体器件测量类似模块壳体等大尺寸结构热阻时,由于其散热好,所测得的温差小,信噪比低,瞬态热测试的精度及分辨率均下降。本文采用外部电阻和热电偶形成加热和温度测试系统,利用电子开关,配合T3ster的控制信号实现了电阻的大功率加热,并完成温度信号采集。实验表明,其测试误差与理论计算值在10%以内,完全满足工程测试需求,且成本低廉。In the transient thermal test method,due to the limited driving capability of the T3 ster,it cannot directly drive highpower semiconductor devices. If a low-power semiconductor device is used to measure the thermal resistance of a large-size structure such as module housing,because the heat dissipation is good,the measured temperature difference is small,and the signal to noise ratio is also low. Therefore,the transient thermal test results accuracy and resolution are all decreased. In this paper,external resistor and thermocouple were integrated. T3 ster achieved high-power heating capability by using electronic sw itches with the control signal,and the temperature response of the external resistor was recorded. Experiments show that the test error is less than 10% compared with the theoretical value,the needs of engineering testing requirement is met,and the cost is low.

关 键 词：瞬态热测试方法 热阻 结构函数 热测试 热阻网络 反卷积 

分 类 号：TN821.8[电子电信—信息与通信工程]