具有良好耐折性的高速化学镀铜研究  

Study of the High Speed Electroless Copper Plating with Favourable Folding Endurance

作　　者：许超[1] 吴敏娴 王文昌[1] 陈智栋[1] XU Chao;Wu Minxian;WANG Wenchang;CHEN Zhidong(School of Petrochemical Engineering,Changzhou University,Changzhou 213164,China)

机构地区：[1]常州大学石油化工学院,江苏常州213164

出　　处：《电镀与精饰》2018年第6期39-42,共4页Plating & Finishing

摘　　要：本文通过在以三乙醇胺(TEA)和乙二胺四乙酸二钠(EDTA?2Na)为络合剂的双络合化学镀铜体系中加入硫酸银,并在聚酰亚胺和铜片基体上制备了化学镀铜镀层。采用等离子发射光谱、扫描电子显微镜及X-射线应力仪对镀层进行表征。结果表明,镀液中添加硫酸银可减小镀层的内应力,增加镀层的韧性。采用该化学镀铜体系,镀铜速率可达28μm/h。硫酸银添加量为20mg/L时,镀铜层的耐折性最好,镀层应力最小,综合性能最佳。In this study,silver sulfate was added into the copper plating bath with two complexingagents of TEA and EDTA·2 Na,and copper coatings were prepared on the substrates of polyimide andcopper sheet. Plasma emission spectrum,scanning electron microscope and X-ray stress analyzer wereemployed to characterize the coatings. The results revealed that the internal stress of the coatings was re-duced and the toughness was increased by adding the Ag2SO4 into the plating bath. The plating rate couldincrease to 28 μm/h with the increase of the content of Ag2SO4 in the bath. The coating with the best fold-ing endurance and minimum stress could be obtained when the Ag2SO4 content of 20 mg/L.

关 键 词：化学镀铜 高速镀 韧性 耐折性 内应力 

分 类 号：TQ153.43[化学工程—电化学工业]