红外CCD探测器半导体制冷组件的研制  

Research on semiconductor refrigeration module for infrared CCD

作　　者：闫浩 朱魁章 高瑶 杨海明 Yan Hao;Zhu Kuizhang;Gao Yao;Yang Haiming(The Provincial key Laboratory of Cryogenic Technology,The 16th Research Institute of CETC,Hefei 230088,China)

机构地区：[1]低温技术安徽省重点试验室,中国电子科技集团公司第十六研究所,合肥230088

出　　处：《低温与超导》2018年第8期82-86,共5页Cryogenics and Superconductivity

摘　　要：红外CCD成像器件在高温环境下工作,暗电流噪声大大增加,严重影响探测灵敏度。对此,使用半导体制冷和真空封装技术设计了探测器制冷组件,使CCD探测器稳定工作在合适温度,以相对较小的体积和功耗显著地提高红外器件的探测灵敏度。本文对探测器制冷组件整体结构、半导体制冷器选型、冷端耦合结构和热端散热结构进行了研究,最终在高温65℃环境下工作时,CCD探测器制冷温度达到-27℃,组件重量0.8kg。When the Infrared CCD device works in a high temperature environment, the dark current noise greatly increases, which seriously affects the detection sensitivity. In this paper, a thermoelectric refrigeration components was designed using semiconductor refrigeration and vacuum packaging technology to make the CCD detector work stably at a appropriate temperature. Then, the sensitivity of infrared instruments was enhanced significantly at the cost of relatively less volume and lower power. The overall structure of the detector refrigeration components, TEC selection, cold side structure and hot side heat dissipation struc- ture were studied. Finally, the CCD detector cooling temperature reach to -27℃ when it worked at a high temperature of 65℃, and the comt-onent weizht was 0.8kg.

关 键 词：CCD探测器 半导体制冷 真空封装 

分 类 号：TB657[一般工业技术—制冷工程]